Axic Iso-Lok 200® ICP Plasma System

Axic Iso-Lok 200® ICP Plasma System

THE AFFORDABLE HIGH-PERFORMANCE DEEP REACTION ION ETCH (DRIE) AND LOW TEMPERATURE PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD) PLASMA PROCESSING SYSTEM

The AXIC Iso-Lok 200® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing.  The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock.  We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.

System Descriptions

In the research and development of plasma processing, there has always been a great demand for a highly versatile and reliable load-locked tool.  With the ever-changing requirements in plasma research, any system must offer the widest range of process parameters and a high degree of repeatability for process verification.  It also must be easily modified for new process requirements.  We believe that our AXIC Iso-Lok 200® ICP Etch/Deposition plasma system satisfies these very demanding requirements. The AXIC Iso-Lok 200® ICP system is a plasma tool that can be used in research, process development, or low volume production for precise etching and deposition on substrates up to 8" in diameter.  The system can also accommodate pieces of wafers or substrates with proper fixturing.In designing the ASIC Iso-Lok 200® ICP tool, a prime directive was to create a system that incorporates a load-lock staging area while maintaining quality and reliability.  Retaining process control for dedicated production oriented systems, while drastically reducing cost and maintenance along with floor space, were critical requirements. The AXIC Iso-Lok 200® Load-Locked Inductively Coupled Plasma (ICP) system’s unique cabinet and electrode design allows for easy installation in a laminar flow module or clean room.  The selection of proven quality components, modular subassemblies, versatile chamber and electrode design, compact size, automation, and field proven process recipes make the AXIC Iso-Lok 200® ICP system the engineer’s “System of Choice”.

Load Lock Module

The system comes with a vacuum load-lock module constructed from anodized aluminum. Load-lock systems are atmosphere to vacuum sample staging and entry modules.  They are a convenient and practical method for transferring samples in and out of vacuum systems without having to vent the chamber to atmosphere.  This significantly improves efficiency and throughput by reducing cycle time and more importantly reducing contamination.  Load-lock allows samples to be exchanged under controlled environmental conditions. The load-lock accommodates wafers from 4” to 8” in diameter with a specific end effector.  An isolation valve is supplied between the load-lock and the process chamber to isolate the sample being transferred.

Features

• Single-piece Al chamber construction
• Load-lock module
• 1,000W, 13.56MHz RF ICP Power
• 600W, 13.56 MHz RF Bias Power
• Auto RF matching

Applications

• DRIE (Deep Reactive Etch)
• High rate and low damage etching
• Submicron etching
• Polyimide etching
• Passivation etching
• Trench etch
• PECVDSiO2 and Si3N4
• Low temperature-low damage
• Carbon nano-tube deposition
• DLC

Utilities

FACILITY REQUIREMENTS

·         Power 208-240V, 50-60 Hz, 20Amps

·         Water 1.5 gallons (6 liters)/minute at 60 psi (4 bars)

·         Gas N2 vent + up to 8 process gases

Premier Solutions Pte Ltd / Axic Iso-Lok 200® ICP Plasma System