Phone

(+65) 6284 3818

Email

sales@premier-sols.com

Enquriy

Bonding

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Description

 

KDF incorporates proprietary Metallic and Silver-Filled epoxy bonding techniques to guarantee that the highest thermal conductivity, electrical properties and adhesive characteristics are achieved. Prior to bonding, targets are sputtered with a protective barrier layer to prevent material diffusion and to increase target surface adhesion. 

 

 

 

Premier Solutions Pte Ltd / Bonding / KDF Electronics

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