Partners

FSM 500TC

0.0/5 rating (0 votes)

Description

 

Material Characterization - Film Stress and wafer bow measurement

 

FSM pioneered in the laser scanning technology for Film Stress and wafer bow measurement.  Several hundred of these tools have been installed in almost every fab, and R&D facilities for Si, GaAS, InP or Flat panel facilities.  Systems are available for room and high temperatures.   High temperature Stress measurements for characterization of thermal properties of new films and process development is available with the following products: FSM 500TC - Stress measurements from ambient to 500 degrees C, for samples up to 200 mm FSM 900LT - Stress Measurements from -90 deg C to 550 deg C FSM 900TC-vac - Stress Measurements from Ambient to 900 deg C, with options up to 1000 degrees C, for both 200 and 300 mm wafers. Operates in a controlled, oxygen free environment, under vacuum or inert gas.

Features

  • Great performance for a desktop film stress hysteresis unit.
  • Can measure film stress up to 500 C.
  • Can measure various wafer sizes.
  • Measures 40 data points per mm, 8k points / 200 mm scan.

 

 

Premier Solutions Pte Ltd / FSM500TC (Material Characterization)

Share this product

Featured Products

  • 1
  • 2
Prev Next

MTI - Tube Furnace

MTI - Tube Furnace

OTF-1600X-III- is a split-able three-zone tube furnace with Kanthal 1650°C grade SiC heating element,  82mm OD Alumina tube •...

Read more

KDF - 900 Series (PVD)

KDF - 900 Series (PVD)

  The 900 Series features dual load lock, in-line, sputter down, batch systems configured with an optional high vacuum load lock and three or four target positions. •...

Read more

Copyright © 2012 - 2015 Premier Solutions Pte. Ltd. All Rights Resrved | Address: 100 Tras Street, 100 AM, #16-01, Singapore 079027. Tel: (65)62843818