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12" High Speed Automatic CMP Polisher w/ Auto Slurry Feeder- Unipol-1203

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Unipol-1203 is a 12" polisher designed for chemical mechanical polishing. The polishing parts are utilized anti-corrosive materials in order to avoid chemical corrosion. Two working stations are equipped along with an automatic slurry feeder and high precision polishing fixture to meet the processing requirements. 



  • Super flat stainless steel polishing plate (RMS: Flatness < 0.25 micron / inch²)
  • High precision rotating plate run-off < 5 microns
  • Color touch screen for polishing settings 
  • Two working stations with individual control
  • Fully automatic control panel to adjust rotating speed, yoke speed and polishing duration, etc
  • Automatic slurry feeder with feeding speed control 
  • High precision polishing controller to adjust pressure and flatness
  • Machine body utilized anti-corrosive materials
  • 208 - 240 VAC, 50 Hz, 450W
Polishing Plate
  • Size: 300 mm diameter
  • Speed: 1 - 240 rpm adjustable
  • Working station: 2
  • Sample holder diameter: 105 mm
  • Conditional ring diameter: 127.5 mm
High Precision Polishing Fixture (Optional)
  • Maximum sample diameter: 100 mm (4")
  • Maximum sample thickness: 12 mm
  • Sample holder travel distance: 12 mm Max. (verticle movement)
  • One digital micrometer is included with a resolution of +/- 1 micron for more accurate lapping
  • Please click the picture to the left for more details
Automatic Slurry Feeder
  • Volume of slurry up to 1.0 Gallon (~3.8L)
  • Can feed any abrasive or polishing slurry with particle size < 40 microns
  • Rotation speed: 8~20 RPM
  • Please click the picture to the left for more details
  • Can be upgraded to four channel automatic slurry feeder at an extra cost, please click the picture below for more details
Other Optional Accessories
  • Automatic mounting press for metallographic sample preparation (Click Pic 1 for details)
  • Six-slot sample loading plate is available at extra cost (Click Pic 2 for details)
  • Consumables for lapping/polishing, such as sandpaper discs (Pic 3), polishing pads (Pic 4), magnetic & buffer steel plates (Pic 5) and diamond polishing paste (Pic 6), can be ordered at MTI
        1 2 3 4 5 6
  • 550 mm L × 700 mm W × 420 mm H without optional accessories
  • 1,000 mm L ×700 mm W × 870 mm H with optional accessories
Net Weight
  • 74 kg
Operation Instruction
  • CE Certified
  • NRTL certification is NOT available temporarily
  • One year limited warranty with lifetime support
  • Rusting and damage due to improper storage condition or maintenance are not covered by warranty
  • Polishing machine applications
Application Notes
  • Add both the weight of the sample(s) and the sample loading plate when calculating total pressing force. For example, assume the sample weighs 0.1 kg. The included flat base sample loading plate weighs 2.5 kg. If a pressing force of 0.5 kgf is set on the machine, the total pressing force is 2.5 + 0.1 + 0.5 = 3.1 kgf
  • If the sample is small compared to the sample loading plate, please do the lapping/polishing with at least 3 similar samples, and mount the samples in a symmetrical, balanced pattern. This is crucial for the normal operation of the machine
  • Clean the machine including the polishing plate and the sample loading plate after each use. The machine must be disconnected from power supply before cleaning! DO NOT use cleaning agents or oil-based liquid! ONLY use water to wipe clean the machine. DO NOT flush the polishing plate sink! Limit the water level in the sink to no higher than 5 mm. Otherwise, the machine circuitry could be damaged by the overflowing water
  • The motor control circuit could be damaged by surge current. DO NOT start the rotary plates from a high rpm! Gradually increase the rotary speed to the desired value. Wait at least 10 sec between switching motor ON/OFF! 

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