Description
Unipol-1200S can be used for lapping / polishing material samples, such as metal, crystal, glass, ceramic, refractory, rocks, PCB board and polymers, with size up to 6" diameter. Customer can adjust the pressing force between the 160 mm Dia. sample loading plate (top) and 300 mm Dia. polishing plate (bottom), as well as their respective rotary speed to meet the processing requirement.
SPECIFICATIONS
| Features | - Adjustable pressing force (0.5 - 20 kgf) for different polishing conditions and materials
- Color touch screen for polishing settings
- Adjustable speed for both sample loading plate and polishing plate
- Adjustable rotation direction for polishing plate (clockwise and counter-clockwise)
- Multiple sample polishing with sample size less than 50 mm in diameter
- Excellent for long duration polishing of tough and hard materials
- Besides standard metallurgical polishing with abrasives, micron-resolution flatting of crystal substrates is available with optional 4" polishing fixture (with vacuum jig and digital thickness indicator)
- Polishing fixture can be moved circumferentially with a swing arm (manual mode)
- Automatic slurry feeding with controlled speed is available with optional slurry feeder
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| Power | - 208 - 240 VAC, 50 / 60 Hz
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| Sample Loading Plate (Top) | - Size: 160 mm Dia.
- Speed: 10 - 80 rpm adjustable (10 - 50 rpm recommended)
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| Polishing Plate (Bottom) | - Size: 300 mm Dia.
- Speed: 20 - 240 rpm adjustable (10 rpm increment)
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| Pressing Force | - 0.5 - 20 kgf (0.5 - 15 kgf recommended)
- 0.5 kgf increment
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| Control Panel | - Start menu (Pic #1), auto mode menu (Pic #2), manual mode menu (Pic #3)
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| Optional | - 4 channels automatic suspensionslurry feeder (Pic 0)
- 4" Polishing fixture with vacuum jig and digital thickness indicator for micron-resolution lapping / polishing (Click Pic 1 for details)
- Automatic mounting press for metallographic sample preparation (Click Pic 2 for details)
- Six-slot sample loading plate is available at extra cost (Click Pic 3 for details)
- Consumables for lapping/polishing, such as sandpaper discs (Pic 4), polishing pads (Pic 5), magnetic & buffer steel plates (Pic #6) and diamond polishing paste (Pic 7), can be ordered at MTI
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| Size | - 660 mm L × 460 mm W × 760 mm H
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| Net Weight | |
| Shipping Weight & Dimension | - 156 kg (345 lbs), 1220 mm L x 1020 mm W x 1090 mm H (48" L x 40" W x 43" H)
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| Operation Instruction | |
| Compliance | - CE Certified
- NRTL certification is NOT available temporarily
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| Warranty | - One year limited warranty with lifetime support
- Rusting and damage due to improper storage condition or maintenance are not covered by warranty
- Polishing machine applications
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| Application Notes | - Add both the weight of the sample(s) and the sample loading plate when calculating total pressing force. For example, assume the sample weighs 0.1 kg. The included flat base sample loading plate weighs 2.5 kg. If a pressing force of 0.5 kgf is set on the machine, the total pressing force is 2.5 + 0.1 + 0.5 = 3.1 kgf
- If the sample is small compared to the sample loading plate, please do the lapping / polishing with at least 3 similar samples, and mount the samples in a symmetrical, balanced pattern. This is crucial for the normal operation of the machine
- Clean the machine including the polishing plate and the sample loading plate after each use. The machine must be disconnected from power supply before cleaning! DO NOT use cleaning agents or oil-based liquid! ONLY use water to wipe clean the machine. DO NOT flush the polishing plate sink! Limit the water level in the sink to no higher than 5 mm. Otherwise, the machine circuitry could be damaged by the overflowing water
- The motor control circuit could be damaged by surge current. DO NOT start the rotary plates from a high rpm! Gradually increase the rotary speed to the desired value. Wait at least 10 sec between switching motor ON/OFF!
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