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15" Precision Polishing Machine for up to one 8" or three 4" wafers - Unipol-1502

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EQ-UNIPOL-1502 machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 8" diameter. It also can be adopted as a standard grinding and polishing machine for preparing metallographic samples. 



AC 110V and 208-240V (50/60Hz) switchable for worldwide operation.

Power 400W
Two Super Flat Lapping Plate Flatness< 0.25 micron/Inch²
Surface Run-out < 5 micron
  • One cast-iron plate for lapping and one cast aluminum plate for polishing
  • Heavy-duty aluminum case with bright painting
  • Three rocking workstations equipped with wafer holders and condition rings
Sample Size & Workstation
  • Three workstations with 4" sample per running
  • One workstation with 6" sample per running
  • One workstation with 8" sample per running
Adjustable Timer for Auto-stop 0~99 hours
Variable Speed 0 to 125 RPM with digital display

720mm L x 580mm W x 380mm H

Optional Accessories   Pic. 1Pic. 2  Pic. 3" alt="" style="border: 0px;" title="Click to enlarge" />Pic. 4Pic. 5
  • CE Certified
  • NRTL certification is available at the extra cost
Optional Automatic Slurry Feeder
  • Automatic slurry feeder SKZD-2 is not included
  • The plastic rolling container can take the volume of slurry up to 1.0 Gallon (~3.8L) for a long time polishing
  • Please click the left picture to order.
Operation Video                 
  • One year limited warranty with lifetime support
  • Rusting and damage due to improper storage condition or maintenance are not covered by warranty
Shipping Dimensions
  • 48" x 40" x 35" (L x W x H)
Shipping Weight
  • 420 lbs
Application Unipol-1502 allows a sample size up to 8" with a different number of workstations involved. A total of 3 yokes are equipped.

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