Phone(+65) 6284 3818 | sales@premier-sols.com | Enquriy |
EQ-UNIPOL-802 machine is equipped with 8" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 3" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well. Combining with flat sample holder (included), the three-hole metallographic sample holder (optional), and precision thinning fixture (optional), the Unipol 802 can lap and polish various samples automatically.
SPECIFICATIONS
Power | AC 110V and 208-240V (50/60Hz) switchable for worldwide operation. |
Features |
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Super-Flat 8" Lapping Plate | Flatness < 2.5 micron / inch² |
Plate Run-off | < 5 micron |
Aluminum Case | Heavy Duty Cast with Bright Painting (Color: Black) |
Two Work Stations Rocking Speed | 8° Rocking with an adjustable speed of 0 - 20 rocking/minute |
Two Flat Sample Holders | 80 Dia. x 35 T mm for carrying <3" diameter wafer |
Two Condition Rings | 95 O.D. x 88 I.D. x 32 T mm |
Master Plate Speed Range | 0 ~ 250 rpm variable with digital display |
Operation Timer | 0 - 99 hours |
Motor | 300 W high torque DC motor |
Dimensions | 525 L x 350 W x 325 H (mm) |
Net Weight | 120 lbs |
Optional Automatic Slurry Feeder |
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Operation Instructions | |
Optional Parts |
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Warranty |
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Compliance |
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Package Dimensions | 40" x 38" x 30" |
Shipping Weight | 185 lbs |
Applications | Polishing machine applications |