CMS (Combinatorial Materials Science) Series – Advanced Research System utilizing Sputtering or Electron Beam Techniques

Features

Chamber

• Adaptable chamber, base plate, and substrate options
• 18" D x 15" H SS process chamber

Pumping & Gauging

• 1500 l/s Cryo pump
• Wide range vacuum gauge, atm to 1x10^-10 torr
• High precision closed loop pressure control (both upstream and downstream for sputtering applications)

Substrate Handling

• Rotating substrate platen for up to 150mm (6") substrates
• Substrate heating to 800°C with quartz lamp heater
• Single or multi-wafer load lock with manual or computer controlled sample transfer
• High precision PID temperature control loop (when equipped with substrate heating)

Deposition Sources

• Pneumatically actuated source and substrate shutters
• Configurable with six or more magnetron deposition sources
• Cross contamination shielding (when applicable)

Quality & Safety

• Computer control with manual or fully automatic operation
• CE mark, UL listing, CSA, NRTL, and other industry recognized testing certifications available
• Extruded aluminum framework with enclosure panels
• Single service drop power distribution module

Options

Chamber

• UHV configuration
• 24" chamber upgrade
• Multi-process chamber cluster tool configurations

Pumping & Gauging

• Maglev turbo pump
• Dry pumping package
• Residual gas analyzer for in-situ monitoring of process gases or chamber constituents

Deposition Sources

• Available Linear multi-pocket UHV electron beam evaporation source (multi-technique options available)
• HV or UHV compatible magnetron sputter sources

Substrate Handling

• Rotating substrate platen for up to 200mm (8") substrates
• Substrate biasing for sample cleaning (typically RF plasma to remove native oxide layers)
• Substrate bias during deposition to influence features of film microstructure (such as crystal orientation), improve film densification, promote film adhesion, and promotes improved film homogeneity of co-sputtered alloy films
• Substrate heating to 1100°C with element style heater
• Substrate cooling (Liquid and/or LN2)
• Sample flip fixture for coating both sides of the substrate
• Film shaping tool (blade mounted to high precision computer controlled arm)
• Indexable magnetic field at substrate
• In-situ film analysis (Optical process monitor, RHEED, or spectroscopic ellipsometer)

Architecture Overview