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CMS (Combinatorial Materials Science) Series – Advanced Research System utilizing Sputtering or Electron Beam Techniques

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Techniques Offered:

  • Electron Beam Evaporation
  • Thermal Evaporation
  • Magnetron Sputtering
  • Combinatorial Materials Science



  • Extremely capable, advanced research tool
  • Designed to accommodate specific thin film applications such as GMR, CMS, Semiconductor, Nanoscale devices, Photonics, and Photovoltaics
  • Unique system design can be configured for true Ultra High Vacuum performance
  • Field tested and proven design



  • Giant Magnetoresistance (GMR)
  • Combinatorial Materials Science (CMS)
  • Semiconductor
  • Superconductor
  • Nanoscale devices
  • Photonics
  • Photovoltaics (PV)
  • OLED
  • Organic films




  • Adaptable chamber, base plate, and substrate options
  • 18" D x 15" H SS process chamber


Pumping & Gauging

  • 1500 l/s Cryo pump
  • Wide range vacuum gauge, atm to 1x10-10 torr
  • High precision closed loop pressure control (both upstream and downstream for sputtering applications)


Substrate Handling

  • Rotating substrate platen for up to 150mm (6") substrates
  • Substrate heating to 800°C with quartz lamp heater
  • Single or multi-wafer load lock with manual or computer controlled sample transfer
  • High precision PID temperature control loop (when equipped with substrate heating)


Deposition Sources

  • Pneumatically actuated source and substrate shutters
  • Configurable with six or more magnetron deposition sources
  • Cross contamination shielding (when applicable)


Quality & Safety

  • Computer control with manual or fully automatic operation
  • CE mark, UL listing, CSA, NRTL, and other industry recognized testing certifications available
  • Extruded aluminum framework with enclosure panels
  • Single service drop power distribution module




  • UHV configuration
  • 24" chamber upgrade
  • Multi-process chamber cluster tool configurations


Pumping & Gauging

  • Maglev turbo pump
  • Dry pumping package
  • Residual gas analyzer for in-situ monitoring of process gases or chamber constituents


Deposition Sources

  • Available Linear multi-pocket UHV electron beam evaporation source (multi-technique options available)
  • HV or UHV compatible magnetron sputter sources


Substrate Handling

  • Rotating substrate platen for up to 200mm (8") substrates
  • Substrate biasing for sample cleaning (typically RF plasma to remove native oxide layers)
  • Substrate bias during deposition to influence features of film microstructure (such as crystal orientation), improve film densification, promote film adhesion, and promotes improved film homogeneity of co-sputtered alloy films
  • Substrate heating to 1100°C with element style heater
  • Substrate cooling (Liquid and/or LN2)
  • Sample flip fixture for coating both sides of the substrate
  • Film shaping tool (blade mounted to high precision computer controlled arm)
  • Indexable magnetic field at substrate
  • In-situ film analysis (Optical process monitor, RHEED, or spectroscopic ellipsometer)


Architecture Overview

KJLC® eKLipse™ Control Software

Kurt J. Lesker Company® eKLipse™ Controls Software is utilized on all KJLC platforms. The eKLipse™ controls platform utilizes a .NET application running on a Windows PC for its User Interface and Recipe Editor. Equipment automation is accomplished via a standalone Real Time Controller.

Click to view Dwg-SY-eKLipseControlsSoftware_01

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