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Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting EQ-DW0125x65

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 Diamond wire cutting is a state-of-the-art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.


Part Number


Tensile Strength

30 N

  • Electroplated diamond wire with 0.125 mm (+/-0.01) diameter based on a high strength steel wire           
  • 20 microns diamond particle for effectively cutting and slicing of ceramic and crystal.
  • 65 meters (215 feet) per roll as the standard package
  • Perfect for cutting Sapphire or SiC single crystal
  • Super quality made in the USA
  • Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc

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