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Diamond Wire of 0.25 mm Dia.with Optional Length for Wire Saw Cutting -Made in USA - EQ-DW025

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Diamond wire cutting is a state of the art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaminant-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price. 


Part Number EQ-DW025
Tensile Strength 75 N
  • Electroplated diamond wire with 0.25 mm (+/-0.02) diameter based on a high strength steel wire
  • 80 microns diamond particle for effectively cutting and slicing of ceramic and crystal
  • 65 mete (215 feet) or 100 meters (333 feet) or 200 meters (656 feet) per roll as a standard package
  • Perfect for cutting Sapphire or SiC single crystal
  • Super quality Made in the USA
  • Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc.
Test Result From Multiwire Diamond Saw
  • 3" sapphire, 200 / ingot cutting time is about 5 hours
  • 3" SiC, single wafer slicing, cutting time is about 6 hours

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