Phone(+65) 6284 3818 | sales@premier-sols.com | Enquriy |
Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination free coolant during crystal cutting. Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.
Specifications:
Part Number | EQ-DW042x65 |
Tensile Strength | 290 N |
Features |
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