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FSM 127

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Optical Measurements Techniques - Imaging Low Coherence Interferometry


High-Resolution Nano - Topography for Flatness and Local Stress


  • Non-contact
  • Imaging
  • Nano-Topography and Local Stress measurement
  • Die and Wafer Topography measurement capability
  • Large working distance (10 mm or more)
  • High lateral and height resolution
  • A visible light imaging Michelson Low Coherence Interferometer
  • Measures Flatness and Nano-Topography on Die-level
  • Measurement area
  • 40mm x 30 mm
  • Uses interference patterns to determine the surface profile.

Localized Stress Measurement

Inputs to stress measurement w/ FSM 127 system

  • Local surface topography
  • Local wafer thickness (FSM 413 Echoprobe)
  • Local film thickness for most of conductive and insulating films (FSM Thin Film Probe or 4 point probe)


  • Local stress tensor components
  • No third party input required

Configurations The following Configurations are available:

  • FSM127 -150, -200, -300 (Semi-Automated System -motorized, x-y stage for mapping, manual sample load/unload, with MAX wafer diameter 150mm, 200mm, 300mm)
  • FSM127-C2C -200, -300 (Fully Automated System with Robotic Wafer-Handler, 200mm or 300mm )



Premier Solutions Pte Ltd  / FSM 127 - Optical Measurement

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