FSM AquaFlex

Material Characterization - Quantitative Adhesion Testing 4 Point Bend

FSM Aquaflex 4 point bent system for

• Low k, copper, barrier film adhesion strength studies
• Stress induced fractures or failures

FSM Aquaflex 4 point bent system for

• Low k, copper, barrier film adhesion strength studies
• Stress induced fractures or failures

Testing conditions: 
 

• Room Temp or Variable temperature option 
•  Ambient or in liquid

Cohesive Strength Testing and crack velocity Options

• Features Multiple Chambers for Rapid Characterization
• Integrated Sample Preparation and training package for rapid lab setup

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