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Bismuth (Bi) Sputtering Targets
Description
Premier Solutions Pte Ltd is distributing Kurt J Lesker Coporation (KJLC) comprehensive offering of sputtering targets, evaporation sources and other deposition materials which is listed by material throughout the website. Technical specifications of Bismuth (Bi) Sputtering Targets and ordering information is available. Below you may find budgetary pricing for sputtering targets and deposition materials per your requirements. Actual prices may vary due to market fluctuations. Contact This email address is being protected from spambots. You need JavaScript enabled to view it. for current pricing or for a quote on sputtering targets and other deposition products not listed.
Specifications
| Material Type | Bismuth | Theoretical Density (g/cc) | 9.8 | |
| Symbol | Bi | Z Ratio | 0.79 | |
| Atomic Weight | 208.9804 | Sputter | DC | |
| Atomic Number | 83 | Max Power Density(Watts/Square Inch) | 15 | |
| Color/Appearance | Lustrous Reddish White, Metallic | |||
| Thermal Conductivity | 8 W/m.K | Type of Bond | Indium | |
| Melting Point (°C) | 271 | |||
| Coefficient of Thermal Expansion | 13.4 x 10-6/K | |||
Material Notes
- Some materials and manufacturing methods may yield product with higher than average porosity. Performance may be affected according to process requirements.
- Some materials and manufacturing methods may yield product with surface imperfections. In many cases, these imperfections are merely visual defects. Performance may be affected according to process requirements.
Ordering Table
| Materials | Size | Purity | Parts # | Price |
| Bismuth | 1.0" Dia. x 0.125" Thick | 99.999% | EJTBIXX501A2 | P.O.R. |
| Bismuth | 1.0" Dia. x 0.250" Thick | 99.999% | EJTBIXX501A4 | P.O.R. |
| Bismuth | 2.0" Dia. x 0.125" Thick | 99.999% | EJTBIXX502A2 | P.O.R. |
| Bismuth | 2.0" Dia. x 0.250" Thick | 99.999% | EJTBIXX502A4 | P.O.R. |
| Bismuth | 3.0" Dia. x 0.125" Thick | 99.999% | EJTBIXX503A2 | P.O.R. |
| Bismuth | 3.0" Dia. x 0.250" Thick | 99.999% | EJTBIXX503A4 | P.O.R. |
| Bismuth | 4.0" Dia. x 0.125" Thick | 99.999% | EJTBIXX504A2 | P.O.R. |
| Bismuth | 4.0" Dia. x 0.250" Thick | 99.999% | EJTBIXX504A4 | P.O.R. |
Bonded Assemblies Ordering Table
| Material | Size | Purity | Bonding Type | Backing Plate Size | Part # | Price |
| Bismuth | 2.00" Dia x 0.125" Thick | 0.99999 | Elastomer | 2.00" Dia x 0.125" Thick | EJUBIXX502A4 | P.O.R. |
Premier Solutions Pte Ltd - Bismuth (Bi) Sputtering Targets - BiST1
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