Reactive Ion Etcher

Features

• CCP / PECVD
• Anisotropic Etching Characteristics
• Fine machining performance
• Accelerated by the DC BIAS
• W / F and AWLL surface DAMAGE
• Metal contamination, P / T, E / R Low
• Temperature cooling

Specifications

• Chamber Unit

  • Material : Stainness304
  • Chamber size : (Optional)
  • Top shower head(Switched bias)
  • ¼”VCR vent port
  • Window port (I.D40mm)

  Pumping Unit(Gauge)

  • MKS NW40 Auto pressure control valve with
  • Controller
  • 600l/m Rotary pump
  • Capacitance gauge(10torr NW16)
  • ATM sensor
  • Option : High Vacuum unit Turbo pump(magnet type/Full range
  Chamber Unit

  • Material : Hard Anodizing Al with Ceramic insulator
  • 600watt RF power with Matching box
  • Water cooling
  • Max Sample size : 6inch
  • Option : Up/down / Heating - 400℃

  Pumping Unit(Gauge)

  • MKS Ar/O2/SF6 Mass flow controller
  • On/off Diaphram valve unit
  • Option : 2channel addition Gas leak sensor
  Gas Showerhead Unit

  • Material : Hard Anodizing Aluminum with insulator
  • ¼”VCR Gas input port

  Control Unit

  • 15inch Touch pa.nel control
  • System reciepe
  • Interlock (Water/Pneumatic air)
  • Data loading
  Consumable Parts

  • Vacuum sensor
  • Oil in Rotary Oil Pump
  • O-ring
  • Window
  • Pump

Facility Requirements